Home / Products / Integrated Circuits (ICs) / Interface - Telecom / DS3112N+W
Manufacturer Part Number | DS3112N+W |
---|---|
Future Part Number | FT-DS3112N+W |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
DS3112N+W Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Function | - |
Interface | Parallel/Serial |
Number of Circuits | - |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | 150mA |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 256-BGA |
Supplier Device Package | 256-PBGA (27x27) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
DS3112N+W Weight | Contact Us |
Replacement Part Number | DS3112N+W-FT |
BCM56680B1IFSB
Broadcom Limited
BCM56689B0IFSB
Broadcom Limited
BCM56689B0KFSBG
Broadcom Limited
BCM56720B0IFSBG
Broadcom Limited
BCM56720B0KFSB
Broadcom Limited
BCM56822B0KFSB
Broadcom Limited
BCM56854XA2IFSBG
Broadcom Limited
BCM56855A2IFSBG
Broadcom Limited
BCM56855A2KFSBG
Broadcom Limited
BCM5704CKFBG
Broadcom Limited
AT6002A-4AC
Microchip Technology
5SGXEA5N2F40C1N
Intel
EP4CE22E22C9L
Intel
EP4S40G5H40I3N
Intel
XC7VX485T-2FFG1157C
Xilinx Inc.
XC6VLX760-2FFG1760C
Xilinx Inc.
XC2VP30-5FFG1152C
Xilinx Inc.
XC7K160T-1FF676C
Xilinx Inc.
M1A3P600-2FGG144
Microsemi Corporation
EP2SGX130GF40C5NES
Intel